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	<title>soldering &#8211; Roumazeilles.net</title>
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		<title>Reliability of lead-free soldering</title>
		<link>https://www.roumazeilles.net/news/en/wordpress/2011/03/23/reliability-of-lead-free-soldering/</link>
					<comments>https://www.roumazeilles.net/news/en/wordpress/2011/03/23/reliability-of-lead-free-soldering/#respond</comments>
		
		<dc:creator><![CDATA[Yves Roumazeilles]]></dc:creator>
		<pubDate>Wed, 23 Mar 2011 20:23:19 +0000</pubDate>
				<category><![CDATA[Computers]]></category>
		<category><![CDATA[Manufacturing]]></category>
		<category><![CDATA[Sciences]]></category>
		<category><![CDATA[Tech]]></category>
		<category><![CDATA[board]]></category>
		<category><![CDATA[lead-free]]></category>
		<category><![CDATA[PCB-A]]></category>
		<category><![CDATA[soldering]]></category>
		<guid isPermaLink="false">https://www.roumazeilles.net/news/en/wordpress/?p=4852</guid>

					<description><![CDATA[For those of you who asked for more details about the reliability of lead-free soldering (see the end of my previous titled &#8220;Manufacturing of electronic boards&#8220;, I have found an interesting and useful analysis from Numonyx (now Micron Semiconductors). Lead-free and leaded package soldering compatibility &#8211; Backward and forward compatibility This white paper explores the [&#8230;]]]></description>
										<content:encoded><![CDATA[<p><img fetchpriority="high" decoding="async" class="alignright size-full wp-image-4854" title="soldering_reliability" src="https://www.roumazeilles.net/news/en/wordpress/wp-content/uploads/2011/03/soldering_reliability.jpg" alt="" width="446" height="333" srcset="https://www.roumazeilles.net/news/en/wordpress/wp-content/uploads/2011/03/soldering_reliability.jpg 446w, https://www.roumazeilles.net/news/en/wordpress/wp-content/uploads/2011/03/soldering_reliability-300x224.jpg 300w, https://www.roumazeilles.net/news/en/wordpress/wp-content/uploads/2011/03/soldering_reliability-150x112.jpg 150w" sizes="(max-width: 446px) 100vw, 446px" />For those of you who asked for more details about the reliability of lead-free soldering (see the end of my previous titled &#8220;<a href="https://www.roumazeilles.net/news/en/wordpress/2009/05/16/manufacturing-of-electronic-boards/">Manufacturing of electronic boards</a>&#8220;, I have found an interesting and useful analysis from Numonyx (now <a href="https://www.micron.com/">Micron Semiconductors</a>).</p>
<p><center><a href="/ZIP/WP_Soldering_Compatibility.pdf">Lead-free and leaded package soldering compatibility &#8211; Backward and forward compatibility</a></center></p>
<p>This white paper explores the aspect of reliability for this relatively new and specifically difficult soldering technology used in the manufacturing of boards of electronic components soldered according to the newest regulations requiring not to use any lead (even in soldering where it has long been the basis for solder paste because of its low fusion temperature).</p>
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