Reliability of lead-free soldering

For those of you who asked for more details about the reliability of lead-free soldering (see the end of my previous titled “Manufacturing of electronic boards“, I have found an interesting and useful analysis from Numonyx (now Micron Semiconductors).

Lead-free and leaded package soldering compatibility – Backward and forward compatibility

This white paper explores the aspect of reliability for this relatively new and specifically difficult soldering technology used in the manufacturing of boards of electronic components soldered according to the newest regulations requiring not to use any lead (even in soldering where it has long been the basis for solder paste because of its low fusion temperature).


Posted

in

, , ,

by

Comments

Leave a Reply

Your email address will not be published. Required fields are marked *

This site uses Akismet to reduce spam. Learn how your comment data is processed.